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Half Etching Technology

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Process Lab Micron Co., Ltd. provides technical services for precision processing using etching, plating, and laser technologies, and introduces the "Half Etching Technology." 【Standard Half】 ■ A method to reduce the thickness of the mask for high-aspect ratio parts. 【Smooth Half】 ■ Reduces step edges compared to the standard half, decreasing the burden on the squeegee. 【Reverse Half】 ■ A method to increase the thickness of the mask for parts that require solder volume. 【P-Surface Half】 ■ A method for forming reliefs when the surface of the printed material has irregularities. *For more details, please refer to the PDF document or feel free to contact us.

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